Main Article Content

Abstract

Untuk mencegah faktor subjektivitas dan potensi human error saat pengecekan kualitas produk casting manufacturing secara manual, penelitian ini bertujuan mengembangkan sistem Automated Visual Inspection (AVI) berbasis AI. Metode yang digunakan dengan pendekatan Deep learning berbasis Convolutional Neural Network (CNN) dengan membandingkan kinerja antara arsitektur AlexNet dan Development architecture. Proses evaluasi menggunakan 6.633 citra riil hasil preprocessing yang terbagi atas kelas defect dan non-defect untuk data training dan validasi. Hasil eksperimen membuktikan keunggulan architecture AlexNet yang mencatatkan akurasi hingga 99,25% dengan validation loss sebesar 0,02481, sementara architecture pengembangan hanya menghasilkan tingkat akurasi 89,07%. Hasil analisis confusion matrix juga memperlihatkan tingkat kestabilan AlexNet yang sangat tinggi dengan nilai presisi, recall, serta F1-score melebihi 0,99. Kesimpulan dari penelitian ini menegaskan bahwa architecture AlexNet memiliki efektivitas yang jauh lebih tinggi dalam mendeteksi cacat pada komponen pengecoran logam, menjadikannya opsi yang sangat relevan untuk diaplikasikan dalam sistem kendali mutu otomatis di industri.

Keywords

Automated Visual Inspection Deep Learning Convolutional Neural Network AlexNet Casting Manufacturing Automated Visual Inspection; Deep learning; Convolutional Neural Network; AlexNet; Casting Manufacturing

Article Details

How to Cite
Ariefa, I., Sendie Yuliarto Margen, Della Kumalaningrum, Komar Roni, & Hawa Rizka. (2026). Automated Visual Inspection Pada Produk Casting Manufacturing Menggunakan Deep Convolutional Neural Network. Jurnal Ilmiah Momentum, 22(2), 33–39. https://doi.org/10.36499/jim.v22i2.15624

References

  1. Chen, X., Chen, J., Han, X., Zhao, C., Zhang, D., Zhu, K., & Su, Y. (2020). A Light-Weighted CNN Model for Wafer Structural Defect Detection. IEEE Access, 8, 24006–24018. https://doi.org/10.1109/ACCESS.2020.2970461
  2. Fei, Z., Yang, E., Yu, L., Li, X., Zhou, H., & Zhou, W. (2022). A Novel deep neural network-based emotion analysis system for automatic detection of mild cognitive impairment in the elderly. Neurocomputing, 468, 306–316. https://doi.org/10.1016/j.neucom.2021.10.038
  3. Gonzalez, R. C. , & W. R. E. (2008). Digital Image Processing (3rd ed.). Pearson Prentice Hall. (Vol. 3rd).
  4. He, K., Zhang, X., Ren, S., & Sun, J. (2016). Deep Residual Learning for Image Recognition. 2016 IEEE Conference on Computer Vision and Pattern Recognition (CVPR), 770–778. https://doi.org/10.1109/CVPR.2016.90
  5. Hou, M., Li, P., Cheng, S., & Yv, J. (2024). CNN‐based defect detection in manufacturing. Advanced Control for Applications, 6(4). https://doi.org/10.1002/adc2.196
  6. Krizhevsky, A. , S. I. , & H. G. E. (2012). ImageNet classification with deep Convolutional Neural Networks.
  7. LeCun, Y., Bengio, Y., & Hinton, G. (2015). Deep learning. Nature, 521(7553), 436–444. https://doi.org/10.1038/nature14539
  8. Park, S.-H., Lee, K.-H., Park, J.-S., & Shin, Y.-S. (2022). Deep Learning-Based Defect Detection for Sustainable Smart Manufacturing. Sustainability, 14(5), 2697. https://doi.org/10.3390/su14052697
  9. Shi, H., Ouyang, Q., Wang, X., Yang, Y., Song, T., Hao, J., & Huang, X. (2022). Insight into the formation of conjugated ladder structure of polyacrylonitrile by X-ray photoelectron spectroscopy. Measurement, 200, 111565. https://doi.org/10.1016/j.measurement.2022.111565
  10. Shi, R., Yu, X., Chen, H., Jiao, Y., Chen, J., Chen, F., & He, S. (2023). Research on the behaviour and mechanism of void welding based on multiple scales. High Temperature Materials and Processes, 42(1). https://doi.org/10.1515/htmp-2022-0271
  11. Tan, M., & Le, Q. V. (2020). EfficientNet: Rethinking Model Scaling for Convolutional Neural Networks.
  12. Wang, S., Xia, X., Ye, L., & Yang, B. (2021). Automatic Detection and Classification of Steel Surface Defect Using Deep Convolutional Neural Networks. Metals, 11(3), 388. https://doi.org/10.3390/met11030388
  13. Yu, Q., Yang, H., Lin, K.-Y., & Li, L. (2021). A self-organized approach for scheduling semiconductor manufacturing systems. Journal of Intelligent Manufacturing, 32(3), 689–706. https://doi.org/10.1007/s10845-020-01678-8